Process Diagnostics Expertise
We help customers be more efficient
X-trinsic’s broad-based expertise in the processing of semiconductor wafers enables us to help customers be more efficient in developing or optimizing their own process flows. We are able to help with various unit processes in the wafering sequence, including slicing, edge grinding, surface grinding, and polishing or CMP. We are leaders in optimizing process parameters to achieve high-quality wafers with the desired thickness, shape, and surface finish. Our expertise also includes troubleshooting and problem-solving in the manufacturing process, ensuring consistency and precision in wafer production to meet stringent industry standards for high-performance semiconductor devices.
Proficient in:
- Wafer Manufacturing
- Wafer Slicing
- Wafer Grinding
- Surface Preparation
- Polishing or CMP
- Cost Modeling and Minimizing Cost per Wafer
- Optimizing Processes for Quality and Repeatability